QSIL553灌注封裝膠 Encapsulants & Potting

FEATURE(產品簡介)
  • THERMALLY CONDUCTIVE
  • UL94 V0 APPROVED FILE NO. E205830
  • LOW MODULUS
  • 1:1 MIX RATIO
DESCRIPTION(產品簡介)

SILCOTHERM 2 PART ADDITION CURE SILICONE ENCAPSULANT

參數表PARAMETERS

  • CODE

    QSil553

  • FEATURE 1

    Thermally conductive o

  • FEATURE 2

    UL94 V0 Approved file No. E205830

  • FEATURE 3

    Low modulus

  • FEATURE 4

    1:1 Mix Ratio

  • APPEARANCE

    Viscous liquid

  • TEST CONDITIONS

    After 15 minutes at 150°C

  • COLOUR

    Grey

  • COLOUR A PART

    Beige

  • COLOUR b

    Black

  • SG

    1.63

  • SG a part

    1.6

  • SG b part

    1.6

  • MIN WORKING TEMP - °C

    -55 °C

  • MAX WORKING TEMP +°C

    260°C

  • FDA

    No

  • SHELF LIFE

    24mths

  • MAX STORAGE TEMPERATURE °C

    30 °C

  • PACK TYPE

    2-Part Kit

  • MIX RATIO

    1:1

  • RHEOLOGY

     Liquid

  • VISCOSITY A-PART MPAS

    6000mPas

  • VISCOSITY b-PART MPAS

    6000 mPas

  • VISCOSITY mixed PART MPAS

    6000 mPas

  • NON CORROSIVE

    Yes

  • CURE TYPE

    Addition

  • RTV OR HEAT CURE

    Heat Accelerated RTV

  • SELF BONDING

    NO

  • UL 94V-0

    YES

  • DURO SHORE a

    45

  • TENSILE MPA

    1.72 MPa

  • ELONGATION %

    240 %

  • TEAR KN/M

    7.8 kN/m

  • MODULUS @ 100% STRAIN MPA

    1.24MPa

  • CTE VOLUMETRIC PPM/°C

    650 ppm/°C

  • CTE LINEAR PPM/°C

    217 ppm/°C

  • DIELECTRIC CONSTANT @ 1KHZ

    3.08

  • DIELECTRIC STRENGTH KV/MM

    >18 kV/mm

  • DISSIPATION FACTOR @ 1KHZ

    0.009

  • MAX CURE HRS @ 25 °C

    24HRS

  • MAX CURE mins @ 100 °C

    7mins

  • THERMAL CONDUCTIVITY W/MK

    >0.68 W/mK

  • VOLUME RESISTIVITY OHMS CM

    4.02E+14 ohms cm

  • POT LIFE MINS

    100mins

  •