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AS1402接著密封膠 Adhesive

FEATURE(產品簡介)
  • FAST CURE WITH HEAT
  • GOOD ADHESION TO MOST SUBSTRATES
  • THIXOTROPIC PASTE
  • TRANSLUCENT
DESCRIPTION(產品簡介)

1 PART HEAT CURED SILICONE ADHESIVE SEALANT PASTE

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參數表PARAMETERS

  • CODE

    AS1402

  • FEATURE 1

    Fast cure with heat

  • FEATURE 2

    Good adhesion to most substrates

  • FEATURE 3

    Thixotropic paste

  • FEATURE 4

    Translucent

  • APPEARANCE

    Thixotropic paste

  • TEST CONDITIONS

    After 1 hour at 150°C

  • COLOUR

    Translucent

  • SG

    1.03

  • MIN WORKING TEMP - °C

    -5 °C

  • MAX WORKING TEMP +°C

    15°C

  • FDA

    No

  • SHELF LIFE

    6mths

  • PACK TYPE

    1-Part  

  • RHEOLOGY

    Paste

  • TEAR KN/M

    3.1 kN/m

  • EXTRUSION RATE G/MIN

    440 g/min

  • MODULUS YOUNGS MPA

    0.38 MPa

  • MODULUS @ 100% STRAIN MPA

    0.54MPa

  • LINEAR SHRINKAGE %

    2%

  • NON CORROSIVE

    Yes

  • CURE TYPE

    Addition

  • RTV OR HEAT CURE

    Heat Cured

  • SELF BONDING

    Yes

  • UL 94V-0

    No

  • DURO SHORE a

    30

  • TENSILE MPA

    1.5MPa

  • ELONGATION %

    295 %

  • MAX CURE minS @ 100 °C

    40mins

  • CTE VOLUMETRIC PPM/°C

    874 ppm/°C

  • CTE LINEAR PPM/°C

    291 ppm/°C

  • LAP SHEAR ALUMINIUM KG/CM²

    8.25 kg/cm²

  • THERMAL CONDUCTIVITY W/MK

    >0.2 W/mK

  • DIELECTRIC STRENGTH KV/MM

    18 kV/mm

  • VOLUME RESISTIVITY OHMS CM

    >1E+15 ohms cm