QSIL556灌注封裝膠 Encapsulants & Potting
FEATURE(產品簡介)
- LOW VISCOSITY
- LOW FLAMMABLILITY, UL94V0 APPROVED FILE NO. E205830
- 1:1 MIX RATIO
- SOLVENT FREE
DESCRIPTION(產品簡介)
2 PART ADDITION CURE SILICONE ENCAPSULANT
參數表PARAMETERS
- CODE
QSIL556
- FEATURE 1
Low viscosity
- FEATURE 2
Low flammablility, UL94V0 approved file No. E205830
- FEATURE 3
1:1 Mix Ratio
- FEATURE 4
Solvent free
- APPEARANCE
Dark grey viscous liquid
- TEST CONDITIONS
After 15 minutes at 150°C
- COLOUR
Grey
- COLOUR A PART
Beige
- COLOUR b
Black
- SG
1.38
- MIN WORKING TEMP - °C
-50 °C
- MAX WORKING TEMP +°C
275°C
- FDA
No
- SHELF LIFE
24 mths
- MAX STORAGE TEMPERATURE °C
30 °C
- PACK TYPE
2-Part Kit
- MIX RATIO
1:1
- RHEOLOGY
Viscous Liquid
- VISCOSITY A-PART MPAS
1100Pas
- VISCOSITY b-PART MPAS
2300 mPas
- VISCOSITY mixed PART MPAS
1700mPas
- NON CORROSIVE
Yes
- CURE TYPE
Addition
- RTV OR HEAT CURE
Heat Acclerated RTV
- SELF BONDING
no
- UL 94V-0
Yes
- DURO SHORE a
46
- TENSILE MPA
1.9 MPa
- ELONGATION %
75 %
- MAX CURE minS @ 100 °C
30mins
- MAX CURE HRS @ 25 °C
24HRS
- MAX CURE mins @ 100 °C
15MINS
- CTE VOLUMETRIC PPM/°C
700 ppm/°C
- CTE LINEAR PPM/°C
233 ppm/°C
- DIELECTRIC STRENGTH KV/MM
17.5 kV/mm
- DIELECTRIC CONSTANT @ 1KHZ
3.36
- DISSIPATION FACTOR @ 1KHZ
0.002
- THERMAL CONDUCTIVITY W/MK
>0.32 W/mK
- POT LIFE MINS
65mins
- VOLUME RESISTIVITY OHMS CM
1E+14 ohms cm