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QSIL573灌注封裝膠 Encapsulants & Potting

FEATURE(產品簡介)
  • THERMALLY CONDUCTIVE
  • 1:1 MIX RATIO
  • GOOD FLOW PROPERTIES
  • MEETS THE REQUIREMENTS OF UL94 V0 BUT IS NOT CERTIFIED
DESCRIPTION(產品簡介)

SILCOTHERM 2 PART ADDITION CURE SILICONE ENCAPSULANT

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參數表PARAMETERS

  • CODE

    QSIL573

  • FEATURE 1

    Thermal Conductive

  • FEATURE 2

    1:1 Mix Ratio

  • FEATURE 3

    Good Flow Properties

  • FEATURE 4

    Meets the requirements of UL94 V0 but is not certified

  • APPEARANCE

    viscous liquid

  • TEST CONDITIONS

    After 15 minutes at 150°C

  • COLOUR

    Grey

  • COLOUR A PART

    White

  • COLOUR b

    Grey

  • SG

    2.1

  • SG A PART

    2.1

  • SG B PART

    2.1

  • MIN WORKING TEMP - °C

    -50 °C

  • MAX WORKING TEMP +°C

    200°C

  • FDA

    No

  • SHELF LIFE

    24 mths

  • MAX STORAGE TEMPERATURE °C

    25 °C

  • PACK TYPE

    2-Part Kit

  • MIX RATIO

    1:1

  • RHEOLOGY

    Viscous Liquid

  • VISCOSITY A-PART MPAS

    6000Pas

  • VISCOSITY b-PART MPAS

    6000 mPas

  • VISCOSITY mixed PART MPAS

    6000mPas

  • NON CORROSIVE

    Yes

  • CURE TYPE

    Addition

  • RTV OR HEAT CURE

    Heat Acclerated RTV

  • SELF BONDING

    no

  • UL 94V-0

    NO

  • DURO SHORE a

    65

  • TENSILE MPA

    1.05 MPa

  • ELONGATION %

    50%

  • lINEAR SHRINKAGE

    0.1%

  • MAX CURE minS @ 100 °C

    35mins

  • MAX CURE HRS @ 25 °C

    24HRS

  • MAX CURE mins @ 100 °C

    15MINS

  • CTE VOLUMETRIC PPM/°C

    465 ppm/°C

  • CTE LINEAR PPM/°C

    155 ppm/°C

  • DIELECTRIC CONSTANT @ 1KHZ

    4.92

  • DISSIPATION FACTOR @ 1KHZ

    0.005

  • THERMAL CONDUCTIVITY W/MK

    1.19 W/mK

  • POT LIFE MINS

    180mins

  • VOLUME RESISTIVITY OHMS CM

    5.6E+13 ohms cm